}
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  •   Indian Tenders   › Tender Notice : 48770314

    • Bids Are Invited For Heat Sink For Artix-7 Fpga, High Performance Maxiflow With Thermal Tape Attachment , Heat Sink For Kintex-7 Fpga, Maxiflow Cross Cut High Performance Heat Sinks With Hardware Attachment Heat Sink For Kintex-7 Fpga, Maxiflow Cross, Bengaluru Urban-Karnataka

    Department Of Telecommunications has published Bids Are Invited For Heat Sink For Artix-7 Fpga, High Performance Maxiflow With Thermal Tape Attachment , Heat Sink For Kintex-7 Fpga, Maxiflow Cross Cut High Performance Heat Sinks With Hardware Attachment Heat Sink For Kintex-7 Fpga, Maxiflow Cross. Submission Date for this Tender is 29-04-2025. Heat Exchangers Tenders in Bengaluru Urban Karnataka. Bidders can get complete Tender details and download the document.




    Tender Notice

    48770314
    Bids Are Invited For Heat Sink For Artix-7 Fpga, High Performance Maxiflow With Thermal Tape Attachment , Heat Sink For Kintex-7 Fpga, Maxiflow Cross Cut High Performance Heat Sinks With Hardware Attachment Heat Sink For Kintex-7 Fpga, Maxiflow Cross
    Open Tender
    Indian
    Karnataka
    Bengaluru Urban
    29-04-2025

    Tender Documents

    Tender Details

    Bids Are Invited For Heat Sink For Artix-7 Fpga, High Performance Maxiflow With Thermal Tape Attachment , Heat Sink For Kintex-7 Fpga, Maxiflow Cross Cut High Performance Heat Sinks With Hardware Attachment Heat Sink For Kintex-7 Fpga, Maxiflow Cross Cut , Extruded Heat Sink Total Quantity : 330

    Key Value

    Document Fees
    Refer document
    EMD
    Refer document
    Tender Value
    INR 2.38 Lakhs /-

    Attachment

    FileName File Description File Size
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