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Tender For Requirement Of Wafers- Borosilicate Wafer ● Dia: 4 Inch ● Thickness: 1000 ± 20 Μm ● 2-Side Polished ● Primary Flat: 32.5 Mm Fused Silica Wafer ● Dia: 4 Inch +/- 0.2 Mm ● Thickness: 1000 ± 25 Μm ● 2-Side Polished Ttv: < 10 Μm ● Primary -At:, Chandigarh-Chandigarh

Central Scientific Instruments Organisation has published Tender For Requirement Of Wafers- Borosilicate Wafer ● Dia: 4 Inch ● Thickness: 1000 ± 20 Μm ● 2-Side Polished ● Primary Flat: 32.5 Mm Fused Silica Wafer ● Dia: 4 Inch +/- 0.2 Mm ● Thickness: 1000 ± 25 Μm ● 2-Side Polished Ttv: < 10 Μm ● Primary -At:. Submission Date for this Tender is 13-01-2025. Laboratory Equipment Tenders in Chandigarh Chandigarh. Bidders can get complete Tender details and download the document.




Tender Notice

47019213
Tender For Requirement Of Wafers- Borosilicate Wafer ● Dia: 4 Inch ● Thickness: 1000 ± 20 Μm ● 2-Side Polished ● Primary Flat: 32.5 Mm Fused Silica Wafer ● Dia: 4 Inch +/- 0.2 Mm ● Thickness: 1000 ± 25 Μm ● 2-Side Polished Ttv: < 10 Μm ● Primary -At:
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NCB
Chandigarh
Chandigarh
13-01-2025

Tender Details

Tender For Requirement Of Wafers- Borosilicate Wafer ● Dia: 4 Inch ● Thickness: 1000 ± 20 Μm ● 2-Side Polished ● Primary Flat: 32.5 Mm Fused Silica Wafer ● Dia: 4 Inch +/- 0.2 Mm ● Thickness: 1000 ± 25 Μm ● 2-Side Polished Ttv: < 10 Μm ● Primary -At: 32.50Mm +/- 2.50 Mm ● Oh Content: < 300 Ppm

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