

Central Scientific Instruments Organisation has published Tender For Requirement Of Wafers- Borosilicate Wafer ● Dia: 4 Inch ● Thickness: 1000 ± 20 Μm ● 2-Side Polished ● Primary Flat: 32.5 Mm Fused Silica Wafer ● Dia: 4 Inch +/- 0.2 Mm ● Thickness: 1000 ± 25 Μm ● 2-Side Polished Ttv: < 10 Μm ● Primary -At:. Submission Date for this Tender is 13-01-2025. Laboratory Equipment Tenders in Chandigarh Chandigarh. Bidders can get complete Tender details and download the document.
Copyright © 2025 · All Rights Reserved. Terms of Usage | Privacy Policy
For Tender Information Services Visit : TenderDetail