}
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    • Bids Are Invited For Precision Diamond Cutting Machine, Magnetic Fixation System, Magnetic Fixation System, Silicon Carbide Abrasive Paper Disc, Silicon Carbide Abrasive Paper Disc, Silicon Carbide Abrasive Paper Disc, Silicon Carbide Abrasive Paper D, New Delhi-Delhi

    Department of Higher Education has published Bids Are Invited For Precision Diamond Cutting Machine, Magnetic Fixation System, Magnetic Fixation System, Silicon Carbide Abrasive Paper Disc, Silicon Carbide Abrasive Paper Disc, Silicon Carbide Abrasive Paper Disc, Silicon Carbide Abrasive Paper D. Submission Date for this Tender is 28-11-2024. Cutting Crimping and Punching Tools Tenders in New Delhi Delhi. Bidders can get complete Tender details and download the document.




    Tender Notice

    46077617
    Bids Are Invited For Precision Diamond Cutting Machine, Magnetic Fixation System, Magnetic Fixation System, Silicon Carbide Abrasive Paper Disc, Silicon Carbide Abrasive Paper Disc, Silicon Carbide Abrasive Paper Disc, Silicon Carbide Abrasive Paper D
    Open Tender
    Indian
    Delhi
    New Delhi
    28-11-2024

    Tender Details

    Bids Are Invited For Precision Diamond Cutting Machine, Magnetic Fixation system, Magnetic Fixation system, Silicon Carbide Abrasive Paper Disc, Silicon Carbide Abrasive Paper Disc, Silicon Carbide Abrasive Paper Disc, Silicon Carbide Abrasive Paper Disc, Silicon Carbide Abrasive Paper Disc, Silicon Carbide Abrasive Paper Disc, Polishing Cloths, Aerosol Spray for Damond Paste, Colloidal Silica, Diamond Paste, Diamond Paste, Diamond Paste, Diamond Paste, Diamond Paste, Sample holder, Polishing Suspension Levigated Alumina Regular Total Quantity : 895

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