

Ministry Of Defence has published Bids Are Invited For Bcd Arduino Uno (Q3) , Buz Mini Buzer (Q3) , Jumper Wire Strip Mm Mf Ff B (Q3) , Casing Box For Micro-Controller And Bluetooth (Q3) , Bread Board Mb-102 (Q3) , Bluetooth Module Hc-05 (Q3) , Bluetooth Module Hc-06 (Q3) , Ribbon Wi. Submission Date for this Tender is 19-01-2024. Printed Circuit Assemblies Tenders in Ernakulam Kerala. Bidders can get complete Tender details and download the document.
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