Tender For Thin Film Deposition System, Bangalore-Karnataka

Tender For Thin Film Deposition System 1. Main chamber a. 14-16”-inch cylindrical/spherical chamber for sputtering with load lock to create a vacuum of 5x 10- 7 torr or better with all CF ports for turbo, sputter guns, load lock, heater flange, and pressure gauges. b. The main chamber should have ports for 4 number of 2 dia sputter guns in confocal arrangement. c. Out of these four ports (point b), two sputter sources with motorized shutter (for 2 dia target) should be provided now. Two ports will be left as blank ports currently. d. Provision for N2 gas vent [nitrogen cylinder will be provided by the user]. e. Sample holder with a pneumatic shutter. It should be possible to heat the sample (2 dia sample) to 8000C or higher with PID controller. PID programmable controller and power supply for heater should be provided. f. Motor controlled rotation of the sample holder (max speed atleast 10 RPM) and manual updown movement of the holder by at least 25mm should be allowed. 1 number 2. Load lock a. Load lock for 2” dia sample with magnetic transfer rod for sample and target exchange to and from the chamber. The load lock should have a port for connecting Hipace 80 turbopump, which should be provided as a blank currently as the turbo pump 1 number will be connected in future. Currently, it will be pumped by the dry backing pump of the main chamber. Appropriate venting arrangements using nitrogen gas should be provided [nitrogen cylinder will be provided by the user]. b. Keep provision for connecting a mass flow controller for future. c. A manual gate valve should be there to separate the chamber from load lock. d. Two blank ports for 2 sputter sources (for 2 dia). [sputter sources will be put in future] and viewports should be present in loadlock. e. Heating sample upto 300 deg C with PID [quote as optional item] 3. RF power supply RF power supply 300W with auto matching network and cables (Seren USA make or RFVII USA or Barthel Germany) for sputter source (provide the price separately) 1 number 4. DC power supply DC supply 500W (ADL Germany make or Prevac) for sputter source (provide the price separately) 1 number 5. Digital Mass flow controller Digital Mass flow controller (Alicat USA make) with 30 gases pre-loaded (0-100 SCCM flow range) (provide the price separately) for the main chamber. 3 number 6. Pumping system a. The user will provide a turbo pump with DN-100 CF flange with controller, splinter shield, cooling fan, vent valve, cables etc for pumping the main chamber. The vendor needs to connect this pump to the deposition chamber in IISc. b. The vendor should quote a dry backing pump (Pfeiffer make) with pumping capacity of atleast 10 m3/hr along with Pirani gauge and cold cathode gauge (IKR 251). (provide the price separately) c. A pirani gauge for the load lock. d. This dry pump will be used as backing of main chamber turbo pump and pumping the load lock as well. e. Please quote hi-space 80 turbo pump with a dry backing pump and cold cathod guage (IKR 251) for the load-lock as optional item (provide the price separately) 1 1 1 7. Water chiller a. PID programmable water chiller (1KW) with water manifold, flow switch with appropriate flow rate to perform sputtering. b. There should safety interlock like water flow switch to prevent sputtering without the required 1 water flow. 8. Baking arrangement The Chamber can be baked to 170 degrees with baking tapes etc. The baking tapes, power supply etc. should be included in the quote. 1 9. Instrumentation rack Proper instrumentation rack should be provided to mount the system and all components As required by the design 10. Accessories The vendor should specify and quote required accessories to run the system.

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