Government Departments has published procure equipment namely Semi-Automated Single Wafer Silicon Wafer Grinder and Polisher.. Submission Date for this Tender is 10-10-2012. procure equipment namely Semi-Automated Single Wafer Silicon Wafer Grinder and Polisher for 150mm and 200mm dia wafer. Tenders in chandigarh Chandigarh. Bidders can get complete Tender details and download the document.
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