}
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    • Tender For Feasibility Study For Etching And Hermetic Sealing Of Cavities In Thick Silicon Wafer In Presence Of Buffer Gases, delhi-Delhi

    Department Of Defence Research And Development has published Tender For Feasibility Study For Etching And Hermetic Sealing Of Cavities In Thick Silicon Wafer In Presence Of Buffer Gases. Submission Date for this Tender is 27-07-2023. Feasibility Studies Tenders in delhi Delhi. Bidders can get complete Tender details and download the document.




    Tender Notice

    38534173
    Tender For Feasibility Study For Etching And Hermetic Sealing Of Cavities In Thick Silicon Wafer In Presence Of Buffer Gases
    Single
    Indian
    Delhi
    Delhi
    27-07-2023

    Tender Details

    Feasibility Study For Etching And Hermetic Sealing Of Cavities In Thick Silicon Wafer In Presence Of Buffer Gases

    Key Value

    Document Fees
    Refer document
    EMD
    INR 59333.0 /-
    Tender Value
    Refer document
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