}
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    • Tender For Lapping And Polishing Machine For Gan Wafers, delhi-Delhi

    Department Of Defence Research And Development has published Tender For Lapping And Polishing Machine For Gan Wafers. Submission Date for this Tender is 12-07-2023. Grinding Sanding and Polishing Equipment Tenders in delhi Delhi. Bidders can get complete Tender details and download the document.




    Tender Notice

    38211063
    Tender For Lapping And Polishing Machine For Gan Wafers
    Open Tender
    NCB
    Delhi
    Delhi
    12-07-2023

    Tender Details

    Lapping And Polishing Machine For Gan Wafers , Lapping And Polishing Machine For Gan Wafers , Lapping And Polishing Machine For Gan Wafers As Per Specification Detail Attached At Annexure V (Including 36 Months Warranty)

    Key Value

    Document Fees
    Refer document
    EMD
    INR 219000.0 /-
    Tender Value
    Refer document
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