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Tender Document For Supply, Installation, Testing Of Equipment, Material At Cse Departments -, SANGLI-Maharashtra

Walchand College Of Engineering has published Tender Document For Supply, Installation, Testing Of Equipment, Material At Cse Departments -. Submission Date for this Tender is 19-03-2023. Connectors Supply Tenders in SANGLI Maharashtra. Bidders can get complete Tender details and download the document.




Tender Notice

36765293
Tender Document For Supply, Installation, Testing Of Equipment, Material At Cse Departments -
Open Tender
NCB
Maharashtra
Sangli
19-03-2023

Tender Details

Tender Document For Supply, Installation, Testing Of Equipment, Material At Cse Departments -1 HARDWARE 3 D Printer- S1 Pro 2 Snapmaker 2.0 (CNC)- A350T : Dimensions (WxDxH): 495 × 506 × 580 mm 3D Printing : Work Area (W × D × H) Max Heated Bed Temperature : 80℃ Laser Engraving and Cutting : Work Area (W × D) : 320 × 350 mm CNC Carving : Enclosure : Build Volume : 12.6 x 13 x 13.8 3 ELECTRONIC SENSORS: YD Lidar G2: • Range Frequency5000Hz • Scan Frequency5-12Hz • Range Distance0.12-12m • Scan Angle360° • Angle Resolution0.36°-0.864° • Size Φ73.7*42.5mm 4 RP Lidar A3: 360° laser scanner, White object: 20 m, Dark object: 10m TBD, Sample Rate: 16000 - 10000 tps, Scan Rate: 10-20 Hz, Angular Resolution: 0.225°, Supports former SDK protocols. 5 Here+ RTK Base USB connector module: Centimeter-level GNSS positioning for the mass market, Integrated Real Time Kinematics (RTK) for fast time-to-market, Smallest, lightest, and energy-efficient RTK module Complete and versatile solution due to base and rover variants 6 Here3 GNSS(M8P) RTK GPS Module- Receiver Type : u-blox M8 high precision GNSS modules (M8P), SatelliteConstellation:GPSL1C/A,GLONASS L1OF, BeiDou B1I, Positioningaccuracy:3DFIX:2.5m/RTK:0.025mProcessor: STM32F302 IMUsensor:ICM20948 NavigationUpdateRateMax:8Hz, Communication Protocol CAN, OperatingTemperature:-40°Cto85°C Dimension:76mmx76mmx16.6mm Weigh:48.8g 7 Intel Real Sense Depth Camera- • Use Environment Indoor/Outdoor • Image Sensor Technology Global Shutter • Ideal Range : 0.3 m to 3 m • Depth Technology Stereoscopic • Minimum Depth Distance (Min-Z) at Max Resolution: ~28cm • Depth Accuracy : <2% at 2 m • Depth Field of View (FOV) : 87°×58° (±3°) • Depth Stream Output Resolution : Up to 1280 × 720 • Depth Stream Output Frame Rate : Up to 90 fps • RGB Frame Resolution : 1920 × 1080 • RGB Frame Rate : 30 fps • RGB Sensor FOV : 69° × 42° • RGB Sensor Resolution : 2 MP • Vision Processor Board :Intel RealSense Vision Processor D4 • Dimension : 90 mm (L) × 25 mm (D) × 25 mm (H) • Connectors : USB-C* 3.1 Gen 1 8 Jetson Nano Module- • Memory Capacity: 4 GB 64-bit LPDDR4 1600MHz - 25.6 GB/s • Input/Output: 3x UART, 2x SPI, 2x I2S, 4x I2C, GPIOs • Storage: 16 GB eMMC 5.1 Flash • Display: HDMI 2.0 or DP1.2 | eDP 1.4 | DSI (1 x2) 2 simultaneous • GPU: NVIDIA Maxwell architecture with 128 NVIDIA CUDA cores 0.5 TFLOPs (FP16) • DL Accelerator: 0.5 TFLOPs (FP16) • CPU: Quad-core ARM Cortex-A57 MPCore processor • Vision Accelerator: 7-Way VLIW Vision Processor • Video Encode: 250 MP/sec | 1x 4K @ 30 (HEVC) | 2x 1080p @ 60 (HEVC) | 4x 1080p @ 30 (HEVC) • Video Decode: 500 MP/sec | 1x 4K @ 60 (HEVC) | 2x 4K @ 30 (HEVC) | 4x 1080p @ 60 (HEVC) | 8x 1080p @ 30 (HEVC) • Camera: 12 lanes (3x4 or 4x2) MIPI CSI-2 D-PHY 1.1 (18 Gbps) • UPHY: 1 x1/2/4 PCIE, 1x USB 3.0, 3x USB 2.0 • Connectivity: Wi-Fi requires external chip, 10/100/1000 BASE-T Ethernet • Dimensions (WxHxD): 69.6 mm x 45 mm • Mechanical: 260-pin edge connector 9 Jetson Nano Developers Kit- • Memory Capacity: 4 GB 64-bit LPDDR4 25.6 GB/s • Input/Output: HDMI, USB • Storage: microSD (not included) • Display: HDMI and DP • GPU: 128-core Maxwell • CPU: Quad-core ARM A57 @ 1.43 GHz • Video Encode: 4K @ 30 | 4x 1080p @ 30 | 9x 720p @ 30 (H.264/H.265) • Video Decode: 4K @ 60 | 2x 4K @ 30 | 8x 1080p @ 30 | 18x 720p @ 30|(H.264/H.265) • Camera: 2x MIPI CSI-2 DPHY lanes • Connectivity: Gigabit Ethernet, M.2 Key E • Dimensions (WxHxD): 4x USB 3.0, USB 2.0 Micro-B • Mechanical: 100 mm x 80 mm x 29 mm 10 PRACTICAL ROBOTS Dobot Robot Arm-4 Axis ,Destop with 3 D Printing,Pick and Place,Pen Holder 11 Turtlebot 3 Burger- • Maximum trans vel : 0.22 m/s • Maximum rot. vel :84 rad/s • Maximum payload : 15kg • Size : 138mm (L) x 178mm (W) x 192mm (H) • Weight : 1kg • Differential Drive • ROS Supported 12 SOFTWARE- Fusion 360 - Autodesk Fusion 360 (for 7 access) 13 SOFTWARE- Colab Pro- Colab Pro Latest version (for 7 access)

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