}
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    • Bids Are Invited For 18 Layer- 2.3M 10% Foilmethod, Jd3mc Carrier Card Pn M1020102003 Pkg Micropack (Q3) , Jd3mc Asio Card 12 Layers, 2.38Mm 10% Thickness, Pn M1020106000 Rev 00 Micro Pack (Q3) , 14 Layer-2.33Mm-Foilmethod, Jd3mc Graphics Card Pn: M1, Hyderabad-Telangana

    Department of Defence Production has published Bids Are Invited For 18 Layer- 2.3M 10% Foilmethod, Jd3mc Carrier Card Pn M1020102003 Pkg Micropack (Q3) , Jd3mc Asio Card 12 Layers, 2.38Mm 10% Thickness, Pn M1020106000 Rev 00 Micro Pack (Q3) , 14 Layer-2.33Mm-Foilmethod, Jd3mc Graphics Card Pn: M1. Submission Date for this Tender is 20-03-2023. Machine Tools Tenders in Hyderabad Telangana. Bidders can get complete Tender details and download the document.




    Tender Notice

    36389716
    Corrigendum : Bids Are Invited For 18 Layer- 2.3M 10% Foilmethod, Jd3mc Carrier Card Pn M1020102003 Pkg Micropack (Q3) , Jd3mc Asio Card 12 Layers, 2.38Mm 10% Thickness, Pn M1020106000 Rev 00 Micro Pack (Q3) , 14 Layer-2.33Mm-Foilmethod, Jd3mc Graphics Card Pn: M1
    Open Tender
    Indian
    Telangana
    Hyderabad
    20-03-2023

    Tender Details

    Bids Are Invited For 18 Layer- 2.3M 10% Foilmethod, Jd3mc Carrier Card Pn M1020102003 Pkg Micropack (Q3) , Jd3mc Asio Card 12 Layers, 2.38Mm 10% Thickness, Pn M1020106000 Rev 00 Micro Pack (Q3) , 14 Layer-2.33Mm-Foilmethod, Jd3mc Graphics Card Pn: M1020103002, Ms. Micropack (Q3) , Stroke Card Pcb, 12 Layered Fr4 Pcb, Thickness: 1.93Mm Size: 143.75Mm X 74Mm, Pn: M1020105002 Of M (Q3) , Video Card Pcb, M1020104002, 12Layer-2Mm- Foilmethod, Pn M1020104002 , Grade: Mil-Prf-55110G (Amendmen (Q3) Mse Total Quantity : 957

    Corrigendum Details

    Sr No CorrigendumDate Corrigendum CorrigendumType NewSubmissionDate
    1 15-03-2023 20-03-2023

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