}
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    • Tender For Pcb Fabrication, Component Procurement, And Assembly Of Components On Pcbs (Quantity 25 No.) Which Is Developed As A Carrier Board For Application Specific Integrated Circuit Or Packaged Chip., Bhubaneswar-Odisha

    National Institute Of Science Education And Research has published Tender For Pcb Fabrication, Component Procurement, And Assembly Of Components On Pcbs (Quantity 25 No.) Which Is Developed As A Carrier Board For Application Specific Integrated Circuit Or Packaged Chip.. Submission Date for this Tender is 12-12-2022. Printed Circuit Assemblies Tenders in Bhubaneswar Odisha. Bidders can get complete Tender details and download the document.




    Tender Notice

    34953855
    Tender For Pcb Fabrication, Component Procurement, And Assembly Of Components On Pcbs (Quantity 25 No.) Which Is Developed As A Carrier Board For Application Specific Integrated Circuit Or Packaged Chip.
    Open Tender
    Indian
    Odisha
    Bhubaneswar
    12-12-2022

    Tender Details

    Tender For Pcb Fabrication, Component Procurement, And Assembly Of Components On Pcbs (Quantity 25 No.) Which Is Developed As A Carrier Board For Application Specific Integrated Circuit Or Packaged Chip.

    Key Value

    Document Fees
    INR 500 /-
    EMD
    Refer document
    Tender Value
    Refer document
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