}
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    • Bids Are Invited For Multi Wire Saw (Mws) Cutting Machine For Slicing Of Silicon Carbide (Sic) Single Crystal Ingot / Bou (Q3) Total Quantity : 1, HYDERABAD-Telangana

    Centre For Materials For Electronics Technology has published Bids Are Invited For Multi Wire Saw (Mws) Cutting Machine For Slicing Of Silicon Carbide (Sic) Single Crystal Ingot / Bou (Q3) Total Quantity : 1. Submission Date for this Tender is 14-11-2022. Cutting Crimping and Punching Tools Tenders in HYDERABAD Telangana. Bidders can get complete Tender details and download the document.




    Tender Notice

    34409584
    Corrigendum : Bids Are Invited For Multi Wire Saw (Mws) Cutting Machine For Slicing Of Silicon Carbide (Sic) Single Crystal Ingot / Bou (Q3) Total Quantity : 1
    Open Tender
    Indian
    Telangana
    Hyderabad
    14-11-2022

    Tender Details

    Bids Are Invited For Multi Wire Saw ( Mws ) Cutting Machine For Slicing Of Silicon Carbide ( Sic ) Single Crystal Ingot / Bou ( Q3 ) Total Quantity : 1

    Corrigendum Details

    Sr No CorrigendumDate Corrigendum CorrigendumType NewSubmissionDate
    1 10-11-2022 14-11-2022

    Key Value

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    Tender Value
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