}
  • Home   ›
  •   Indian Tenders   › Tender Notice : 30275185

    • Bids Are invited for Foundry / Fab. Services (ASIC, RFIC, MMIC, MEMS, SOC, MCM etc.): Engineering Support (DRC,FDR,Reticle) - Foundry / Fab. Services (ASIC, RFIC, MMIC, MEMS, SOC, MCM etc.): Engineering Support (DRC,FDR,Reticle) , Mask Set Fabrication as -Gujarat

    Department Of Space has published Bids Are invited for Foundry / Fab. Services (ASIC, RFIC, MMIC, MEMS, SOC, MCM etc.): Engineering Support (DRC,FDR,Reticle) - Foundry / Fab. Services (ASIC, RFIC, MMIC, MEMS, SOC, MCM etc.): Engineering Support (DRC,FDR,Reticle) , Mask Set Fabrication as . Submission Date for this Tender is 24-12-2021. Packing Boxes Tenders in Gujarat. Bidders can get complete Tender details and download the document.




    Tender Notice

    30275185
    Bids Are invited for Foundry / Fab. Services (ASIC, RFIC, MMIC, MEMS, SOC, MCM etc.): Engineering Support (DRC,FDR,Reticle) - Foundry / Fab. Services (ASIC, RFIC, MMIC, MEMS, SOC, MCM etc.): Engineering Support (DRC,FDR,Reticle) , Mask Set Fabrication as
    Open Tender
    Indian
    Gujarat
    24-12-2021

    Tender Details

    Bids Are invited for Foundry / Fab. Services (ASIC, RFIC, MMIC, MEMS, SOC, MCM etc.): Engineering Support (DRC,FDR,Reticle) - Foundry / Fab. Services (ASIC, RFIC, MMIC, MEMS, SOC, MCM etc.): Engineering Support (DRC,FDR,Reticle) , Mask Set Fabrication as per RFP Doc No.: SAC/OCT/2021/02 - Mask Set Fabrication as per RFP Doc No.: SAC/OCT/2021/02 , PH25 Wafer Fabrication as per RFP Doc No.: SAC/OCT/2021/02 - PH25 Wafer Fabrication as per RFP Doc No.: SAC/OCT/2021/02 , On Wafer DC and RF Tests as per Table-3.3 of RFP for maximum 9 type of circuits per wafer. - On Wafer DC and RF Tests as per Table-3.3 of RFP for maximum 9 type of circuits per wafer. , 100% space level Visual Inspection Dicing, Picking, Packaging with identification and placing of KGDs and Bad dies in separate ESD safe Gel pack boxes - 100% space level Visual Inspection Dicing, Picking, Packaging with identification and placing of KGDs and Bad dies in separate ESD safe Gel pack boxes , Wafer Acceptance Test as per RFP Doc No.: SAC/OCT/2021/02 - Wafer Acceptance Test as per RFP Doc No.: SAC/OCT/2021/02 , Lot Acceptance Test (1 Circuit across two wafers) as per RFP Doc No.: SAC/OCT/2021/02 - Lot Acceptance Test (1 Circuit across two wafers) as per RFP Doc No.: SAC/OCT/2021/02 , LAT based on TCV. - LAT based on TCV. Total Quantity : 1

    Key Value

    Document Fees
    Refer document
    EMD
    Refer document
    Tender Value
    Refer document
    Disclaimer :
    We takes all possible care for accurate & authentic tender information, however Users are requested to refer Original source of Tender Notice / Tender Document published by Tender Issuing Agency before taking any call regarding this tender.
    Tell us about your Product / Services,
    We will Find Tenders for you
    Cnet Technologies

    We are a group of professionals specializing in custom software development, web development, mobile app development, IOT base solutions, web design, graphics & Enterprise solutions provid.

    About Us

    Services

    Browse Tenders

    For Sales Inquiry

    Connect With Us

    Copyright © 2025 · All Rights Reserved. Terms of Usage | Privacy Policy

    For Tender Information Services Visit : TenderDetail