Supply Of Pm6 Auto Precision Lapping And Polishing Machine (Ii) Triple Station Wafer Substrate Bonding Unit With Pump (Iii) Ncg-2 Non-Contact Thickness Measurement Gauge (Iv) Aws1 Abrasive Wire Saw With Consumables, Director, Sspl, Delhi-Delhi

TDR : 23416807

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Director, Sspl, Delhi , Delhi

Tender Brief : Supply Of Pm6 Auto Precision Lapping And Polishing Machine (Ii) Triple Station Wafer Substrate Bonding Unit With Pump (Iii) Ncg-2 Non-Contact Thickness Measurement Gauge (Iv) Aws1 Abrasive Wire Saw With Consumables

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Submission Date
02-03-2020

Competition Type
Indian

Bidding Type
Vendor Enlistment

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Supply Of Pm6 Auto Precision Lapping And Polishing Machine (Ii) Triple Station Wafer Substrate Bonding Unit With Pump (Iii) Ncg-2 Non-Contact Thickness Measurement Gauge (Iv) Aws1 Abrasive Wire Saw With Consumables, Director, Sspl, Delhi-Delhi

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Supply Of Pm6 Auto Precision Lapping And Polishing Machine (Ii) Triple Station Wafer Substrate Bonding Unit With Pump (Iii) Ncg-2 Non-Contact Thickness Measurement Gauge (Iv) Aws1 Abrasive Wire Saw With Consumables, Director, Sspl, Delhi-Delhi

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