}
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    • Assembly And Bonding Of Microwave Components Module Assembly Including Mmic Die Attachment And Wire Bonding For 80 Rf Circuits, DLRL, HYDERABAD-Telangana

    Defence Research And Development Organisation has published Assembly And Bonding Of Microwave Components Module Assembly Including Mmic Die Attachment And Wire Bonding For 80 Rf Circuits. Submission Date for this Tender is 07-10-2019. Excavation Work Tenders in DLRL, HYDERABAD Telangana. Bidders can get complete Tender details and download the document.




    Tender Notice

    21855735
    Assembly And Bonding Of Microwave Components Module Assembly Including Mmic Die Attachment And Wire Bonding For 80 Rf Circuits
    Open Tender
    Indian
    Telangana
    Dlrl, Hyderabad
    07-10-2019

    Tender Details

    Assembly And Bonding Of Microwave Components Module Assembly Including Mmic Die Attachment And Wire Bonding For 80 Rf Circuits , Module Assembly Including Mmic Die Attachment And Wire Bonding For 80 Rf Circuits , Supplying , Conveying And Fixing Spls . Including Earth Work Excavation . , Construction Of Chamber For 100Mm Sluice Plates

    Key Value

    Document Fees
    Refer document
    EMD
    INR 47200.0 /-
    Tender Value
    Refer document
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