Tenders Are Invited For The Procurement Of 2024 Chemical Palladium Plating For Unicompound Semiconductor Corporation

Tender Detail

83924093
0624-244241250002
Self-Funded
Tenders Are Invited For The Procurement Of 2024 Chemical Palladium Plating For Unicompound Semiconductor Corporation
NCB
Eastern Asia
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
27-08-2024

Work Detail

Project Name: The Procurement of 2024 Chemical palladium plating for UniCompound Semiconductor Corporation Tenders are invited for The Procurement of 2024 Chemical Palladium Plating for Unicompound Semiconductor Corporation.The Source of Funds Comes from Enterprise Itself, And the Bid Conditions are Ready. Tendering Agent of Fujian Mach&Elec Equip Tendering Co., Ltd Entrusted by Tenderee, Invites Sealed Bids from Eligible Bidders Home and Abroad for the Supply of the following Goods and Service by Way of Icb. Products List: 1: Chemical Palladium Plating Place of Implementation: Fujian, PRC Beginning of Selling Bidding Documents: 2024-08-05 Ending of Selling Bidding Documents: 2024-08-12 Price of Bidding Documents: 500/$100 Deadline for Submitting Bids/Time of Bid Opening (Beijing Time): 2024-08-27 10:00 Tender Link : https://www.chinabidding.com/en/detail/259978839-BidNoticeEn.html

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