Stfc Interconnect Provides A Range Of Electronic And Detector Assembly Techniques To Scientific Communities Within Stfc And Our External Collaborations. We Have Developed A Process To Perform Surface Preparation And Make Micro Bumps Of Pure Indium Metal, On A Range Of Substrates Including Semiconductor Wafers And Semiconductor Die.The Resulting Bumps Are Then Used In Our Proprietary Flip Chip Process To Make Many Thousands Or Tens-Of-Thousands Of Electrical/Mechanical Connections In A Single Bonding Step.The Deposition Process Involves Masking Prior To Deposition, Then Deposition, Followed By Removal Of Masked Areas, Leaving The Desired Bumps In Place. Photo Lithography (Negative Resist, Lift-Off) And Shadow Masking Techniques Are Both Used. We Are Now Scaling This Process Into Production And Need New Equipment Capable Of Depositing On Multiple Substrates Per Day.
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